Direct Multi-Lateral Wafer Bonding for New Functionality in Photonic Integrated Circuits

Author

Jayaraman, Vijaysekhar ; Hall, Eric ; Leonard, Devin

Author_Institution

Praevium Res., Inc, Hollister

fYear

2006

fDate

6-8 Dec. 2006

Firstpage

180

Lastpage

183

Abstract

This paper demonstrates direct wafer bonding along multiple cleaved facets in a single bonding step. This enables monolithic photonic integrated circuits with new functionality that cannot be realized by traditional integration approaches such as re-growth or selective area growth. We demonstrate the utility of this new technique in fabricating monolithic coarse wavelength division multiplexed (CWDM) laser arrays and ultra-broadband superluminescent diodes.

Keywords

integrated optics; monolithic integrated circuits; optical fabrication; semiconductor laser arrays; superluminescent diodes; wafer bonding; wavelength division multiplexing; coarse wavelength division multiplexed device; direct multilateral wafer bonding; laser array fabrication; monolithic CWDM arrays; monolithic photonic integrated circuits; multiple cleaved facets; single bonding step; ultra-broadband superluminescent diode fabrication; Bonding forces; Gallium arsenide; Indium phosphide; Optical arrays; Photonic integrated circuits; Semiconductor laser arrays; Semiconductor materials; Substrates; Superluminescent diodes; Wafer bonding; CWDM; Wafer-bonding; photonic integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Optoelectronic and Microelectronic Materials and Devices, 2006 Conference on

Conference_Location

Perth, WA

Print_ISBN

978-1-4244-0578-7

Electronic_ISBN

978-1-4244-0578-7

Type

conf

DOI

10.1109/COMMAD.2006.4429910

Filename

4429910