DocumentCode :
2767038
Title :
Cross comparison of fatigue lifetime testing on silicon thin film specimens
Author :
Kamiya, S. ; Tsuchiya, T. ; Ikehara, T. ; Sato, K. ; Ando, T. ; Namazu, T. ; Takashima, K.
Author_Institution :
Nagoya Inst. of Technol., Nagoya, Japan
fYear :
2011
fDate :
23-27 Jan. 2011
Firstpage :
404
Lastpage :
407
Abstract :
This paper reports the comparison among the results obtained by various types of testing for evaluating fatigue lifetime of silicon specimens, performed in 6 institutions in Japan. The experiment covers a variety of single crystal silicon (SCS) specimens fabricated on the same SOI wafers with 5 μm device layer thickness as well as additional specimens made separately in some institutions. In summary, although their initial strength under monotonically increasing load was reported ranging from 2 GPa to 8 GPa depending on the designs, fatigue lifetime was observed with a unique trend which can be well formulated on the basis of Paris´ law to describe equivalent fatigue crack extension process.
Keywords :
fatigue cracks; fatigue testing; life testing; silicon; SOI wafers; equivalent fatigue crack extension process; fatigue lifetime testing; silicon thin film specimens; single crystal silicon; Fatigue; Humidity; Mathematical model; Micromechanical devices; Silicon; Stress; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location :
Cancun
ISSN :
1084-6999
Print_ISBN :
978-1-4244-9632-7
Type :
conf
DOI :
10.1109/MEMSYS.2011.5734447
Filename :
5734447
Link To Document :
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