• DocumentCode
    2767038
  • Title

    Cross comparison of fatigue lifetime testing on silicon thin film specimens

  • Author

    Kamiya, S. ; Tsuchiya, T. ; Ikehara, T. ; Sato, K. ; Ando, T. ; Namazu, T. ; Takashima, K.

  • Author_Institution
    Nagoya Inst. of Technol., Nagoya, Japan
  • fYear
    2011
  • fDate
    23-27 Jan. 2011
  • Firstpage
    404
  • Lastpage
    407
  • Abstract
    This paper reports the comparison among the results obtained by various types of testing for evaluating fatigue lifetime of silicon specimens, performed in 6 institutions in Japan. The experiment covers a variety of single crystal silicon (SCS) specimens fabricated on the same SOI wafers with 5 μm device layer thickness as well as additional specimens made separately in some institutions. In summary, although their initial strength under monotonically increasing load was reported ranging from 2 GPa to 8 GPa depending on the designs, fatigue lifetime was observed with a unique trend which can be well formulated on the basis of Paris´ law to describe equivalent fatigue crack extension process.
  • Keywords
    fatigue cracks; fatigue testing; life testing; silicon; SOI wafers; equivalent fatigue crack extension process; fatigue lifetime testing; silicon thin film specimens; single crystal silicon; Fatigue; Humidity; Mathematical model; Micromechanical devices; Silicon; Stress; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
  • Conference_Location
    Cancun
  • ISSN
    1084-6999
  • Print_ISBN
    978-1-4244-9632-7
  • Type

    conf

  • DOI
    10.1109/MEMSYS.2011.5734447
  • Filename
    5734447