• DocumentCode
    2767122
  • Title

    Tapered Undercut-Etching-Active-Region for Integrating Spot-Size Converter and Electroabsorption Modulator

  • Author

    Lin, Fang-Zheng ; Tsai, Shun-An ; Wu, Tsu-Hsiu ; You, Jia-Shun ; Chiu, Yi-Jen

  • Author_Institution
    Nat. Sun Yat-Sen Univ., Kaohsiung
  • fYear
    2006
  • fDate
    6-8 Dec. 2006
  • Firstpage
    236
  • Lastpage
    238
  • Abstract
    A new structure integrating traveling-wave electroabsorption modulator (TWEAM) with optical spot-size converter (SSC) was proposed. The active waveguide was formed by using selectively undercut-wet-etching-active-region (UEAR) method, which can avoid the submicron photolithography of tapered active waveguide in the SSC region. About 5 dB improvement in optical insertion loss is measured, resulting from small 5.7deg (horizontal)x 8.8deg (vertical) beam divergence angles and large plusmn 2.9 mum (horizontal) x plusmn2.2 mum (vertical) 1 dB alignment tolerances from the SSC facet. 18 GHz of -3 dB bandwidth and modulation efficiency of 20 dB/V can be obtained in this device.
  • Keywords
    electro-optical modulation; etching; integrated optoelectronics; optical losses; optical waveguides; optical wavelength conversion; alignment tolerances; beam divergence angles; frequency 18 GHz; modulation efficiency; optical insertion loss; optical spot-size converter; submicron photolithography; tapered active waveguide; tapered undercut-etching-active-region; traveling-wave electroabsorption modulator; undercut-wet-etching-active-region method; Etching; High speed optical techniques; Indium phosphide; Insertion loss; Integrated optics; Optical coupling; Optical fibers; Optical modulation; Optical waveguides; Semiconductor waveguides;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optoelectronic and Microelectronic Materials and Devices, 2006 Conference on
  • Conference_Location
    Perth, WA
  • Print_ISBN
    978-1-4244-0578-7
  • Electronic_ISBN
    978-1-4244-0578-7
  • Type

    conf

  • DOI
    10.1109/COMMAD.2006.4429924
  • Filename
    4429924