DocumentCode
2767271
Title
Multi-scale triangular patch high impedance ground plane to improve the bandwidth of conformal bow-tie antennas
Author
Cakiroglu, Bora ; Collins, Peter J. ; Havrilla, Michael J. ; Sertel, Kubilay ; Terzuoli, Andrew J.
Author_Institution
Air Force Inst. of Technol., Dayton, OH
fYear
2008
fDate
5-11 July 2008
Firstpage
1
Lastpage
4
Abstract
We demonstrate the realization and performance of a conformal bow-tie antenna printed on a multi-scale triangular element mushroom structure high-impedance ground-plane (HIGP). The two-scale HIGP was designed to exhibit a large frequency band-gap to cover the relatively broad operational frequency bandwidth of the bow-tie antenna. HIGP elements were chosen to be triangular to form a natural commensurate blending of the bow-tie into the structure. We characterize the experimental performance of the bow-tie-HIGP combination from 2-10GHz and demonstrate that the negative effects of a perfect electric conductor ground-plane may be mitigated by using a HIGP.
Keywords
bow-tie antennas; conformal antennas; energy gap; microstrip antennas; conformal bow-tie antennas; multi-scale triangular element mushroom structure high-impedance ground-plane; patch antennas; Antenna measurements; Bandwidth; Broadband antennas; Dipole antennas; Frequency; Impedance; Microstrip antennas; Patch antennas; Photonic band gap; Resonance;
fLanguage
English
Publisher
ieee
Conference_Titel
Antennas and Propagation Society International Symposium, 2008. AP-S 2008. IEEE
Conference_Location
San Diego, CA
Print_ISBN
978-1-4244-2041-4
Electronic_ISBN
978-1-4244-2042-1
Type
conf
DOI
10.1109/APS.2008.4619318
Filename
4619318
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