Title :
Zr-based metallic glass as a novel MEMS bonding material
Author :
Lin, Y.-C. ; Froemel, J. ; Sharma, P. ; Inoue, A. ; Esashi, M. ; Gessner, T.
Author_Institution :
WPI Adv. Inst. for Mater. Res., Tohoku Univ., Sendai, Japan
Abstract :
In this study, for the first time we successfully bonded Si substrates with sputtered Zr-Al-Cu-Ni metallic glassy material. The surface pre-treatment with formic acid vapor plays a remarkable function for oxides removal before bonding. Metallic glasses have fundamentally glassy structure and exhibit a Newtonian viscous flow in the supercooled liquid region. The polymer-like plastic fluidity performs superior wettability which improves interfacial integrity. This paper introduces a unique functional material and reveals its high potential for MEMS bonding application.
Keywords :
aluminium alloys; copper alloys; glass structure; metallic glasses; micromechanical devices; nickel alloys; plastic flow; sputtering; surface treatment; wetting; zirconium alloys; MEMS bonding material; Newtonian viscous flow; Si; Si substrates; Zr-Al-Cu-Ni; Zr-Al-Cu-Ni metallic glassy material; Zr-based metallic glass; formic acid; glassy structure; interfacial integrity; plastic fluidity; sputtering; supercooled liquid region; surface pre-treatment; wettability; Bonding; Glass; Metals; Micromechanical devices; Silicon; Substrates;
Conference_Titel :
Micro Electro Mechanical Systems (MEMS), 2011 IEEE 24th International Conference on
Conference_Location :
Cancun
Print_ISBN :
978-1-4244-9632-7
DOI :
10.1109/MEMSYS.2011.5734473
