Title :
Structural analysis of packaged VLSI devices using scanning acoustic microscopy
Author_Institution :
Towcester Tech. Services, UK
Abstract :
The author describes the use of scanning acoustic microscopy (SAM) for the inspection of interfaces within the structure of an assembled VLSI component. The advantages of using SAM (non-destructive test) instead of the traditional mechanical shear testing (destructive) or X-ray analysis are discussed also
Keywords :
VLSI; acoustic microscopy; inspection; integrated circuit testing; packaging; inspection; interfaces; non-destructive test; packaged VLSI devices; plastic packages; scanning acoustic microscopy;
Conference_Titel :
Sub-Micron VLSI Reliability, IEE Colloquium on
Conference_Location :
London
