DocumentCode
2768584
Title
NBTI mechanism explored on the back gate bias for pMOSFETs
Author
Chen, Main-Gwo ; Li, Jih-San ; Jiang, Charles ; Liu, Chuan H. ; Su, Kum-Cheng ; Chang, Yih-Jau
Author_Institution
United Microelectron. Corp., Hsin-Chu, Taiwan
fYear
2003
fDate
20-23 Oct. 2003
Firstpage
131
Lastpage
132
Abstract
Negative bias temperature instability had been getting more attention with the scaling down of MOS transistor, accompanied by the thinning of gate oxide. In our experiment of 0.15μm dual gate CMOS process, it is shown that surface hole concentration will have much impact on NBTI by means of Vsb application, no matter for devices of 2.6-nm or 6.5-nm oxide thickness. The NBTI enhancement at high Vsb is believed to be caused by the substrate hot hole injection, which leads to more interface state and positive charge generation, and thus makes NBTI worse. On the other hand, we expect better NBTI results under low gate electric field with Vsb applied, due to reduction of surface hole from Vsb.
Keywords
MOSFET; semiconductor device reliability; semiconductor doping; MOS transistor; NBTI mechanism; Vsb application; back gate bias; dual gate CMOS process; gate oxide thinning; hot hole injection; interface state; low gate electric field; pMOSFETs; positive charge generation; surface hole concentration; Computer hacking; Degradation; Hot carriers; MOSFETs; Niobium compounds; Stress; Substrate hot electron injection; Temperature; Threshold voltage; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 2003 IEEE International
Print_ISBN
0-7803-8157-2
Type
conf
DOI
10.1109/IRWS.2003.1283319
Filename
1283319
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