• DocumentCode
    2768584
  • Title

    NBTI mechanism explored on the back gate bias for pMOSFETs

  • Author

    Chen, Main-Gwo ; Li, Jih-San ; Jiang, Charles ; Liu, Chuan H. ; Su, Kum-Cheng ; Chang, Yih-Jau

  • Author_Institution
    United Microelectron. Corp., Hsin-Chu, Taiwan
  • fYear
    2003
  • fDate
    20-23 Oct. 2003
  • Firstpage
    131
  • Lastpage
    132
  • Abstract
    Negative bias temperature instability had been getting more attention with the scaling down of MOS transistor, accompanied by the thinning of gate oxide. In our experiment of 0.15μm dual gate CMOS process, it is shown that surface hole concentration will have much impact on NBTI by means of Vsb application, no matter for devices of 2.6-nm or 6.5-nm oxide thickness. The NBTI enhancement at high Vsb is believed to be caused by the substrate hot hole injection, which leads to more interface state and positive charge generation, and thus makes NBTI worse. On the other hand, we expect better NBTI results under low gate electric field with Vsb applied, due to reduction of surface hole from Vsb.
  • Keywords
    MOSFET; semiconductor device reliability; semiconductor doping; MOS transistor; NBTI mechanism; Vsb application; back gate bias; dual gate CMOS process; gate oxide thinning; hot hole injection; interface state; low gate electric field; pMOSFETs; positive charge generation; surface hole concentration; Computer hacking; Degradation; Hot carriers; MOSFETs; Niobium compounds; Stress; Substrate hot electron injection; Temperature; Threshold voltage; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop Final Report, 2003 IEEE International
  • Print_ISBN
    0-7803-8157-2
  • Type

    conf

  • DOI
    10.1109/IRWS.2003.1283319
  • Filename
    1283319