Title :
Electromigration discussion group summary
Author :
Schafft, Hany A.
Author_Institution :
NIST, Gaithersburg, MD
Abstract :
Summaries are presented of discussions on the following topics: (A) Non-Damascene Copper Interconnects; (B) Electromigration in Solder Bumps; (C) Stress Voiding; and (D) on AC and Pulsed Electromigration.
Keywords :
Aluminum; Copper; Degradation; Dielectric measurements; Dielectric thin films; Electromigration; Etching; Metallization; Stress; Testing;
Conference_Titel :
Integrated Reliability Workshop Final Report, 2003 IEEE International
Conference_Location :
Lake Tahoe, CA, USA
Print_ISBN :
0-7803-8157-2
DOI :
10.1109/IRWS.2003.1283326
