Hybrid physical field simulation: Transient electro-thermo-mechanical responses of interwafer interconnects under the impact of an EMP

Time-dependent electro-thermo-mechanical transient responses of interwafer interconnects under the impact of an EMP are investigated in this paper. The mathematical methodology is based on hybrid physical field time-domain finite element method (FEM), in which all nonlinearities of temperature-dependent electrical conductivities, thermal conductivities, thermal expansion coefficients, and even the Youngpsilas modulus of materials involved are treated rigorously. Therefore, three-dimensional (3-D) temperature and thermal stress distributions of one- and two-level metal bridge-vias in multi-level interwafer interconnects used for high-density integration of ICs are captured numerically and discussed.