DocumentCode :
2770643
Title :
Limitations of integrating field induced aggregation based fault repair automatons with integrated circuits
Author :
Dutta, Aveek ; Sambandan, Sanjiv
Author_Institution :
Dept. of Instrum. & Appl. Phys., Indian Inst. of Sci., Bangalore, India
fYear :
2012
fDate :
12-14 Sept. 2012
Firstpage :
100
Lastpage :
103
Abstract :
We study the limitations of integrating an automatic self repair mechanism with integrated circuits to heal open faults. The repair mechanism is based on electric field induced diffusion limited aggregation of conductive nano or micro-particles dispersed in an insulating fluid medium. The limitation is posed by the electromigration limit of the particles.
Keywords :
electromigration; insulating materials; integrated circuit interconnections; maintenance engineering; nanoparticles; automatic self repair mechanism; conductive microparticle dispersion; conductive nanoparticle dispersion; diffusion limited aggregation; electric field; electromigration limit; fault repair automation; field limitation integration; insulating fluid medium; integrated circuit interconnection; open fault; Bridge circuits; Circuit faults; Current density; Dispersion; Electric fields; Integrated circuit interconnections; Maintenance engineering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOC Conference (SOCC), 2012 IEEE International
Conference_Location :
Niagara Falls, NY
ISSN :
2164-1676
Print_ISBN :
978-1-4673-1294-3
Type :
conf
DOI :
10.1109/SOCC.2012.6398385
Filename :
6398385
Link To Document :
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