Title :
Electrical and fluidic microbumps and interconnects for 3D-IC and silicon interposer
Author :
Zheng, Li ; Bakir, Muhannad S.
Author_Institution :
Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
High-density electrical microbumps (25 μm diameter and 50 μm pitch) and fluidic microbumps are important to support high-bandwidth signaling, power delivery and microfluidic cooling of high-performance high-power chips in 3DICs and silicon interposer. Simultaneous fabrication of electrical and fluidic microbumps is demonstrated in this paper. Test vehicles are also fabricated for assembly. Four-point resistance measurements and preliminary fluidic testing demonstrate assembly results.
Keywords :
assembling; cooling; electric resistance; elemental semiconductors; integrated circuit interconnections; integrated circuit testing; microfluidics; silicon; three-dimensional integrated circuits; 3DIC; Si; assembly; fabrication; fluidic microbump; fluidic testing; four-point resistance measurement; high-bandwidth signaling; high-density electrical microbump; high-performance high-power chips; interconnects; microfluidic cooling; power delivery; silicon interposer; size 25 mum; size 50 mum; Assembly; Bonding; Cooling; Microfluidics; Silicon; Wires;
Conference_Titel :
SOC Conference (SOCC), 2012 IEEE International
Conference_Location :
Niagara Falls, NY
Print_ISBN :
978-1-4673-1294-3
DOI :
10.1109/SOCC.2012.6398388
