DocumentCode
2771031
Title
Analog design challenges and trade-offs using emerging materials and devices
Author
Fulde, M. ; Mercha, A. ; Gustin, C. ; Parvais, B. ; Subramanian, V. ; Arnim, K.v. ; Bauer, F. ; Schruefer, K. ; Schmitt-Landsiedel, D. ; Knoblinger, G.
Author_Institution
Tech. Univ. Munich, Munich
fYear
2007
fDate
11-13 Sept. 2007
Firstpage
123
Lastpage
126
Abstract
Analog device figures-of-merit change significantly with the introduction of advanced materials and devices such as high-k or Multiple-Gate FETs. Measurements show enhanced intrinsic gain and matching behavior for MuGFETs which help to reduce area and power consumption in analog circuits. However, high-k degrades matching, flicker noise and Vt stability. Measured device performance is used to simulate the impact of these trends on circuit design trade-offs. Migrating from SiON to HfO2 dielectric approximately doubles area and power consumption to keep matching and noise performance constant. Transient Vt instabilities in the range of 10 mV can degrade the resolution of analog-to-digital converters by more than one bit. The use of non-binary ADCs is proposed to overcome these issues.
Keywords
analogue integrated circuits; analogue-digital conversion; circuit stability; field effect integrated circuits; flicker noise; integrated circuit design; MuGFET; SiON; analog circuits; analog design challenges; analog-to-digital converters; flicker noise; multiple-gate FETS; nonbinary ADC; power consumption; transient Vt instabilities; voltage 10 mV; 1f noise; Analog circuits; Area measurement; Degradation; Energy consumption; FETs; Gain measurement; High K dielectric materials; High-K gate dielectrics; Power measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Circuits Conference, 2007. ESSCIRC 2007. 33rd European
Conference_Location
Munich
ISSN
1930-8833
Print_ISBN
978-1-4244-1125-2
Type
conf
DOI
10.1109/ESSCIRC.2007.4430261
Filename
4430261
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