• DocumentCode
    2771487
  • Title

    Influence of the Navier boundary wall slip on flow patterns in micro-scale cavity

  • Author

    Liu, Zhaomiao ; Wang, Guobin ; Shen, Feng

  • Author_Institution
    Coll. of Mech. Eng. & Appl. Electron. Technol., Beijing Univ. of Technol., Beijing, China
  • fYear
    2011
  • fDate
    7-10 Aug. 2011
  • Firstpage
    86
  • Lastpage
    90
  • Abstract
    For the behaviors of micro-fluidics in cavity micro-flow, a CFD numerical simulation is adopted to investigate the slip effects on cavity micro-flow. In addition, a new slip model based on the concept of boundary layer thickness was derived theoretically and tested. It´s found that boundary wall with the Navier slip condition will change the pattern of cavity micro-flow. In the case of pressure driven cavity micro-flow, the slip wall boundary condition will restrain the growth and development of vortex in the cavity. On the lid-shear-driven cavity micro-flow, slip wall boundary condition could change the position and shape of vortex separation line under cavity, yet a stronger degree slip will promote the morphological changes of vortex. Meanwhile the new slip model is more applicable to step-wall boundary condition, which will reveal the process of slip occurrence.
  • Keywords
    Navier-Stokes equations; boundary layers; computational fluid dynamics; confined flow; flow separation; flow simulation; microfluidics; numerical analysis; pattern formation; shear flow; slip flow; vortices; CFD numerical simulation; Navier slip condition; boundary layer thickness; flow pattern; lid-shear driven cavity microflow; microfluidics; pressure driven cavity microflow; slip wall boundary condition; vortex separation line; Boundary conditions; Cavity resonators; Fluids; Numerical models; Solid modeling; Solids; Stress; Navier slip; Vortex; boundary slip; cavity micro-flow; micro-fluidics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechatronics and Automation (ICMA), 2011 International Conference on
  • Conference_Location
    Beijing
  • ISSN
    2152-7431
  • Print_ISBN
    978-1-4244-8113-2
  • Type

    conf

  • DOI
    10.1109/ICMA.2011.5985636
  • Filename
    5985636