Title :
A novel frequency domain SSN method for analysis of high speed circuits
Author_Institution :
INTEL China Ltd., China
Abstract :
In this paper, a novel method on SSN (Simultaneous Switching Noise) analysis has been proposed for high-speed PCB/package system. The method firstly models system layout via full wave EM method, then simulate SSN in time domain. Not only has it high accuracy and efficiency, but also it can fast guide engineers to attach the optimal value of decoupling capacitors on package/board/system according to resonant frequency points. Besides, the method can directly accept transistor model not only IBIS (Input/output Buffer Information Specification), so the accuracy is also higher than some tools which can only accept IBIS models. At last, through the analysis of practical package structure, it is shown that the method has high accuracy compared with the simulation results of speed2k in time domain.
Keywords :
high-speed integrated circuits; integrated circuit packaging; printed circuits; decoupling capacitors; finite differential frequency domain method; full wave EM method; high speed circuits analysis; high-speed PCB; input-output buffer information specification; package system; practical package structure; printed circuit board; simultaneous switching noise analysis; time domain; CMOS technology; Capacitors; Circuit noise; Circuit simulation; Crosstalk; Frequency domain analysis; Laplace equations; Packaging; Time domain analysis; Transfer functions;
Conference_Titel :
Electron Devices and Solid-State Circuits, 2003 IEEE Conference on
Print_ISBN :
0-7803-7749-4
DOI :
10.1109/EDSSC.2003.1283519
