Title :
Electrical characterization of a 64 Ball Grid Array package
Author :
Boyer, Alexandre ; Sicard, Etienne ; Fer, Mathieu ; Courau, Lionel
Author_Institution :
INSA, Univ. of Toulouse, Toulouse
Abstract :
This paper compares several measurement and simulation methods used to extract an electrical model of a 64 pin ball grid array package. This model is fundamental for electromagnetic interference analysis at integrated circuit level.
Keywords :
ball grid arrays; electromagnetic interference; integrated circuit packaging; electrical characterization; electromagnetic interference analysis; integrated circuit level; pin ball grid array package; Circuit analysis; Circuit simulation; Electric variables measurement; Electromagnetic interference; Electromagnetic measurements; Electromagnetic modeling; Electronics packaging; Integrated circuit measurements; Integrated circuit modeling; Integrated circuit packaging; BGA; PEEC; TDR; VNA; on-package measurement; package modelling;
Conference_Titel :
Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
Conference_Location :
Hamburg
Print_ISBN :
978-1-4244-2737-6
Electronic_ISBN :
978-1-4244-2737-6
DOI :
10.1109/EMCEUROPE.2008.4786801
