DocumentCode
2772922
Title
Analysis of charge carrier multiplication events in NPT and PT-diodes triggered by an ionizing particle
Author
Kaindl, W. ; Solkner, G. ; Wachutka, G.
Author_Institution
Inst. for Phys. of Electrotechnol., Munich Univ. of Technol., Germany
fYear
2003
fDate
16-18 Dec. 2003
Firstpage
383
Lastpage
386
Abstract
We report on the modelling and numerical simulation of an ion irradiation experiment employed for characterizing the robustness of discrete power devices against cosmic rays. On the basis of cylinder-symmetrical simulations, we analyse the response of a non-punch-through (NPT) diode to an ionizing particle penetrating the device. The simulations visualize and demonstrate the temporal and spatial evolution of the electric field and the carrier densities. Another result is the accumulated charge generated by the impact of one single ion in the interior of the device. The simulated values conform well with recently reported experimental data. Simulating the device response of a punch-through (PT) diode shows that charge multiplication events, which unavoidably occur at sufficiently large reverse voltages, can lead to the destruction of the device. Moreover, our simulations and experiments also indicate that PT diodes exhibit higher robustness, against cosmic radiation in comparison to NPT diodes.
Keywords
carrier density; cosmic background radiation; diodes; ion beam effects; numerical analysis; robust control; semiconductor device models; semiconductor diodes; carrier density; charge carrier multiplication; charge multiplication; cosmic radiation; cylinder-symmetrical simulations; diodes; discrete power devices; ion irradiation; ionizing particle; modelling; numerical simulation; robustness; spatial evolution; Analytical models; Charge carrier density; Charge carriers; Cosmic rays; Data visualization; Diodes; Discrete event simulation; Numerical models; Numerical simulation; Robustness;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices and Solid-State Circuits, 2003 IEEE Conference on
Print_ISBN
0-7803-7749-4
Type
conf
DOI
10.1109/EDSSC.2003.1283555
Filename
1283555
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