Title :
On the influence of vias on a PCB power-bus
Author :
Heinrich, Gerd ; Dickmann, Stefan
Author_Institution :
Fak. fur Elektrotech., Helmut-Schmidt-Univ., Hamburg
Abstract :
In this paper, a method for the investigation of the influence of a through-hole via on a printed circuit board power-bus is presented. Therefore based on an introduced via model for a through-hole via its scattering parameters are extracted using a de-embedding algorithm. After the following calculation of the via model elements with the two-port theory, the extracted impedances are inserted in a known formula for the power-bus impedance. In addition, it is shown how the signal return current acts as an excitation source of the waveguide modes within the power-bus.
Keywords :
S-parameters; integrated circuit interconnections; printed circuits; two-port networks; PCB power-bus; de-embedding algorithm; printed circuit board power-bus; scattering parameters; through-hole via; Data mining; Electromagnetic compatibility; Electromagnetic waveguides; Impedance; Integrated circuit interconnections; Nonhomogeneous media; Planar waveguides; Printed circuits; Scattering parameters; Voltage; PCB; de-embedding; power-bus; via;
Conference_Titel :
Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
Conference_Location :
Hamburg
Print_ISBN :
978-1-4244-2737-6
Electronic_ISBN :
978-1-4244-2737-6
DOI :
10.1109/EMCEUROPE.2008.4786817
