• DocumentCode
    2773292
  • Title

    Studies on the mechanism of high resolution and high aspect ratio in DFVP

  • Author

    Wen, Tingting ; Zhang, Bin ; Wang, Peiqing

  • Author_Institution
    Inst. of Nucl. Energy Technol., Tsinghua Univ., Beijing, China
  • fYear
    2003
  • fDate
    16-18 Dec. 2003
  • Firstpage
    471
  • Lastpage
    473
  • Abstract
    Development-free vapor photolithography (DFVP) is a unique all-dry pattern transfer technique with many advantages such as superior quality, high aspect ratio and high resolution. This paper analyzes the mechanism of the DFVP and proposes a theory model to explain the cause of its advantages. Experiments are designed and carried out, the result shows the polymer is the main factor affecting the resolution and aspect ratio of the pattern.
  • Keywords
    etching; photolithography; polymer films; SiO2-Si; development free vapor photolithography; dry pattern transfer; etching; polymer; Couplings; Etching; Hafnium; Lithography; Manufacturing; Microelectronics; Polymer films; Resists; Silicon; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices and Solid-State Circuits, 2003 IEEE Conference on
  • Print_ISBN
    0-7803-7749-4
  • Type

    conf

  • DOI
    10.1109/EDSSC.2003.1283575
  • Filename
    1283575
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2773292