• DocumentCode
    2773713
  • Title

    Extraction of causal RLGC models from measurements for signal link path analysis

  • Author

    Zhang, Jianmin ; Chen, Qinghua B. ; Qiu, Zhiqiang ; Drewniak, James L. ; Orlandi, Antonio

  • Author_Institution
    Cisco Syst., Inc., San Jose, CA
  • fYear
    2008
  • fDate
    8-12 Sept. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    A method for developing a causal RLGC model from S-parameter measurements is proposed for single-ended transmission lines with the assumption of 2nd order Debye representation for the substrate dielectric medium. Genetic algorithm, an optimization method, is used to find the causal model parameters and the substrate dielectric properties. The measured S-parameter of a stripline with TRL calibration de-embedded is studied based on the proposed method. Good S-parameter agreement among the measurement, the causal RLGC circuit modeling, and the full-wave simulation has been achieved. The time-domain RLGC circuit simulation for pulse propagation along the stripline demonstrates that the developed model is causal. The comparison of eye-diagrams generated from S-parameters between the modeling, including RLGC circuit and full-wave, and the measurement is shown as well.
  • Keywords
    RLC circuits; S-parameters; genetic algorithms; skin effect; transmission lines; 2nd order Debye representation; S-parameter measurements; causal RLGC models; genetic algorithm; signal link path analysis; single-ended transmission lines; strip transmission line; Calibration; Circuit simulation; Dielectric measurements; Dielectric substrates; Genetic algorithms; Optimization methods; Scattering parameters; Signal analysis; Stripline; Transmission line measurements; Causal RLGC model; Debye model; S-parameters; causality; eyedigram; genetic algorithm; signa link path analysis; strip transmission line;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
  • Conference_Location
    Hamburg
  • Print_ISBN
    978-1-4244-2737-6
  • Electronic_ISBN
    978-1-4244-2737-6
  • Type

    conf

  • DOI
    10.1109/EMCEUROPE.2008.4786839
  • Filename
    4786839