DocumentCode :
2773943
Title :
Leakage increase of narrow and short BCPMOS
Author :
Xu, Y.Z. ; Pohland, O. ; Cai, C. ; Puchner, H.
Author_Institution :
Cypress Semicond., San Jose, CA, USA
fYear :
2004
fDate :
2004
Firstpage :
51
Lastpage :
54
Abstract :
The leakage performance of BCPMOS (buried channel PMOS) is investigated by experimentally varying the LDD implant conditions. An anomalous leakage increase with a boron LDD implant is observed for a small geometry (narrow and short) PMOS. Experimental results indicate that the increase of leakage current for narrow and short channel PMOS can be explained by boron piling up at the edge of the STI and from the source/drain towards the middle of the channel. Further confirmation of boron piling up is proven by the surface channel NMOS threshold voltage. Based on the leakage sensitivity, the BC PMOS LDD is optimized to reduce the leakage current for small geometry transistors.
Keywords :
MOSFET; boron; doping profiles; isolation technology; leakage currents; optimisation; semiconductor device measurement; B; NMOS threshold voltage; PMOS optimization; boron LDD implant conditions; boron STI edge piling; buried channel PMOS; leakage current increase; leakage sensitivity; narrow BCPMOS; short BCPMOS; surface channel NMOS; Boron; CMOS technology; Costs; Degradation; Geometry; Implants; Leakage current; MOS devices; Threshold voltage; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Quality Electronic Design, 2004. Proceedings. 5th International Symposium on
Print_ISBN :
0-7695-2093-6
Type :
conf
DOI :
10.1109/ISQED.2004.1283649
Filename :
1283649
Link To Document :
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