DocumentCode
2773943
Title
Leakage increase of narrow and short BCPMOS
Author
Xu, Y.Z. ; Pohland, O. ; Cai, C. ; Puchner, H.
Author_Institution
Cypress Semicond., San Jose, CA, USA
fYear
2004
fDate
2004
Firstpage
51
Lastpage
54
Abstract
The leakage performance of BCPMOS (buried channel PMOS) is investigated by experimentally varying the LDD implant conditions. An anomalous leakage increase with a boron LDD implant is observed for a small geometry (narrow and short) PMOS. Experimental results indicate that the increase of leakage current for narrow and short channel PMOS can be explained by boron piling up at the edge of the STI and from the source/drain towards the middle of the channel. Further confirmation of boron piling up is proven by the surface channel NMOS threshold voltage. Based on the leakage sensitivity, the BC PMOS LDD is optimized to reduce the leakage current for small geometry transistors.
Keywords
MOSFET; boron; doping profiles; isolation technology; leakage currents; optimisation; semiconductor device measurement; B; NMOS threshold voltage; PMOS optimization; boron LDD implant conditions; boron STI edge piling; buried channel PMOS; leakage current increase; leakage sensitivity; narrow BCPMOS; short BCPMOS; surface channel NMOS; Boron; CMOS technology; Costs; Degradation; Geometry; Implants; Leakage current; MOS devices; Threshold voltage; Voltage measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Quality Electronic Design, 2004. Proceedings. 5th International Symposium on
Print_ISBN
0-7695-2093-6
Type
conf
DOI
10.1109/ISQED.2004.1283649
Filename
1283649
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