• DocumentCode
    2774110
  • Title

    Development and validation of a microcontroller model for EMC

  • Author

    Li, Shaohua ; Bishnoi, Hemant ; Whiles, Jason ; Ng, Pius ; Weng, Haixiao ; Pommerenke, David ; Beetner, Daryl

  • Author_Institution
    EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO
  • fYear
    2008
  • fDate
    8-12 Sept. 2008
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Models of integrated circuits (ICs) allow printed circuit board (PCB) developers to predict radiated and conducted emissions early in board development and allow IC manufactures insight into how to build their ICs better for electromagnetic compatibility (EMC). A model of the power delivery network, similar to the ICEM or LECCS model, was developed for a microcontroller running a typical program and used to predict the noise voltage between the power and return planes of a PCB. The IC and package model was generated using the Apache tool suite. A model of the PCB was created using an electromagnetic cavity model and lumped-element models of components on the board. Values of predicted and measured impedance looking into the IC and PCB matched within a few dB from a few 10s of MHz up to 1 GHz. Measured and predicted values of noise voltage matched within about 6 dB at clock harmonics up to 600-700 MHz.
  • Keywords
    electromagnetic compatibility; integrated circuit design; integrated circuit modelling; lumped parameter networks; microcontrollers; EMC; decoupling; electromagnetic cavity model; integrated circuit design; lumped-element models; microcontroller model; power delivery network; Electromagnetic compatibility; Electromagnetic measurements; Electromagnetic modeling; Integrated circuit manufacture; Integrated circuit modeling; Integrated circuit noise; Microcontrollers; Predictive models; Printed circuits; Voltage; decoupling; electromagnetic compatibility; emissions; integrated circuit design; modeling; power integrity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
  • Conference_Location
    Hamburg
  • Print_ISBN
    978-1-4244-2737-6
  • Electronic_ISBN
    978-1-4244-2737-6
  • Type

    conf

  • DOI
    10.1109/EMCEUROPE.2008.4786860
  • Filename
    4786860