DocumentCode
2774157
Title
Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306)
fYear
1999
fDate
9-11 March 1999
Abstract
Presents the front cover of the proceedings.
Keywords
cooling; integrated circuit packaging; semiconductor device packaging; thermal management (packaging); thermal variables measurement; advanced packaging; aircooled electronics; compact thermal models; thermal management materials; thermal measurement methods;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location
San Diego, CA, USA
ISSN
1065-2221
Print_ISBN
0-7803-5264-5
Type
conf
DOI
10.1109/STHERM.1999.762419
Filename
762419
Link To Document