Title :
Composite Materials for Electronic Packaging and Thermal Management
Author_Institution :
Composites Consultant
Keywords :
Aerospace materials; Composite materials; Electronic packaging thermal management; Electronics packaging; Space technology; Thermal conductivity; Thermal expansion; Thermal management; Thermal management of electronics; Thermal stresses;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-5264-5
DOI :
10.1109/STHERM.1999.762420
