Title :
A computational study of two phase jet impingement cooling of an electronic chip
Author :
Wang, D. ; Yu, E. ; Przekwas, A.
Author_Institution :
CFD Res. Corp., Huntsville, AL, USA
Abstract :
A two phase model has been developed and demonstrated for jet impingement cooling of a silicon chip. The Eulerian two-fluid model is applied for resolution of boiling heat transfer of a phase-change coolant. The simulation result predicts the overall cooling performance and is in reasonably good agreement with the reported experimental data. The boiling effect is found to be more pronounced for natural convection cooling than for the jet impingement scheme. A saturation point of the boiling effect is also observed in the jet impingement case. An optimized flow rate has also been found for the impingement jet cooling of the chip considered.
Keywords :
boiling; circuit analysis computing; cooling; integrated circuit modelling; integrated circuit packaging; jets; natural convection; optimisation; thermal management (packaging); Eulerian two-fluid model; Si; boiling effect; boiling effect saturation point; boiling heat transfer; cooling performance; electronic chip; impingement jet cooling; jet impingement cooling; jet impingement scheme; natural convection cooling; optimized flow rate; phase-change coolant; silicon chip; simulation; two phase jet impingement cooling; two phase model; Computational fluid dynamics; Computational modeling; Electronics cooling; Equations; Gravity; Heat transfer; Mathematical model; Predictive models; Silicon; Thermal conductivity;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-5264-5
DOI :
10.1109/STHERM.1999.762422
