• DocumentCode
    2774257
  • Title

    Thermal parameter estimation in the presence of uncertainty [packaging]

  • Author

    Emery, A.F.

  • Author_Institution
    Washington Univ., Seattle, WA, USA
  • fYear
    1999
  • fDate
    9-11 March 1999
  • Firstpage
    30
  • Lastpage
    33
  • Abstract
    Thermal properties are inferred from experiments by inverse techniques. In contrast to most mechanical and electrical experiments, thermal experiments usually involve boundary conditions and properties that have a degree of uncertainty. This uncertainty complicates the analysis and may lead to increased errors of estimation. This paper describes the application of an extended maximum likelihood principle to better quantify the amount of information yielded by the experiment and to reduce the effect of the uncertainty. The method is applied to an example of determining the contact resistance between a die and a substrate to demonstrate its use.
  • Keywords
    maximum likelihood estimation; thermal analysis; thermal management (packaging); thermal resistance; boundary conditions; contact resistance; die-substrate thermal contact resistance; estimation errors; estimation uncertainty; experimental information quantification; extended maximum likelihood principle; inverse techniques; packaging; thermal parameter estimation; thermal properties; Covariance matrix; Heat transfer; Noise measurement; Parameter estimation; Sensor systems; Temperature measurement; Temperature sensors; Thermal conductivity; Time measurement; Uncertainty;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
  • Conference_Location
    San Diego, CA, USA
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-5264-5
  • Type

    conf

  • DOI
    10.1109/STHERM.1999.762425
  • Filename
    762425