DocumentCode
2774340
Title
Return via connections for extending signal link path bandwidth of via transitions
Author
Chang, Xin ; Archambeault, Bruce ; Cocchini, Matteo ; De Paulis, Francesco ; Sivarajan, Vysakh ; Zhang, Yaojiang ; Fan, Jun ; Connor, Samuel ; Orlandi, Antonio ; Drewniak, Jim
Author_Institution
Missouri Univ. of Sci. & Technol., Rolla, MO
fYear
2008
fDate
8-12 Sept. 2008
Firstpage
1
Lastpage
6
Abstract
This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The equivalent circuit includes capacitance of the via anti-pad as well as cavity effects.
Keywords
electromagnetic compatibility; integrated circuit interconnections; EMI; cavity resonance; equivalent circuit; return current; return via connections; signal link path bandwidth; via transitions; Analytical models; Bandwidth; Capacitors; Circuit simulation; Dielectric losses; Electromagnetic interference; Equivalent circuits; Impedance; Resonance; Signal analysis; EMI; Signal integrity; cavity resonance; via;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
Conference_Location
Hamburg
Print_ISBN
978-1-4244-2737-6
Electronic_ISBN
978-1-4244-2737-6
Type
conf
DOI
10.1109/EMCEUROPE.2008.4786874
Filename
4786874
Link To Document