Thermal performance of single- and joint-extrusions with discrete heat sources

Author

Lall, Balwant S Bill

Author_Institution

Crown Int. Inc., Elkhart, IN, USA

fYear

1999

fDate

9-11 March 1999

Firstpage

65

Lastpage

72

Abstract

A comparative investigation of single- and joint-extrusion approaches to the cooling of discrete heat sources is presented. An analytical approach based on iterations of a conjugate thermal network is presented to provide first-order approximations of the thermal design in quick solution times. Correlations are presented for fin-usage-partitioning due to differences in device location and power for the joint-extrusion approach. CFD results were found to be in good agreement with experimentally measured results. CFD solution is recommended for design refinement beyond the quick-solution first-order design of the analytical scheme.

Keywords

computational fluid dynamics; cooling; design engineering; iterative methods; thermal analysis; thermal management (packaging); CFD; conjugate thermal network iterations; design refinement; device location; device power; discrete heat source cooling; discrete heat sources; fin-usage-partitioning; first-order approximations; first-order design; joint-extrusion approach; joint-extrusions; single-extrusions; solution time; thermal design; thermal performance; Casting; Computational fluid dynamics; Costs; Design optimization; Electronics cooling; Heat sinks; Power dissipation; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE

Conference_Location

San Diego, CA, USA

ISSN

1065-2221

Print_ISBN

0-7803-5264-5

Type

conf

DOI

10.1109/STHERM.1999.762430

Filename

762430