Title :
Thermal conductivity homogeneity and topography characterization
Author :
Mathis, Nancy ; DeSorgo, Miksa
Author_Institution :
Mathis Instrum. Ltd., Fredericton, NB, Canada
Abstract :
Thermal conductivity is a key parameter for evaluating materials involved in thermal management. Thermal conductivity is a consideration at all levels when thermal engineers design for optimum heat dissipation, bonding and homogeneity. Materials have emerged that are filled with high thermal conductivity materials such as boron nitride and graphite. The homogeneity of such materials has been measured through nondestructive localized thermal conductivity testing. The method involves an interfacial transient technique used to evaluate a material in a grid-wise fashion. The minimum sample area of each test location was 5 mm/spl times/50 mm, and the total time that was required for each test was under three minutes. A homogeneity factor (HF) is introduced to relate material results. One of the two formulations tested was determined to be slightly heterogeneous within statistical limits of the test procedure.
Keywords :
cooling; filled polymers; nondestructive testing; thermal conductivity measurement; thermal management (packaging); transient analysis; 5 mm; 50 mm; BN; C; boron nitride filler; graphite filler; grid-wise material evaluation; high thermal conductivity filler materials; homogeneity factor; interfacial transient technique; minimum sample area; nondestructive localized thermal conductivity testing; optimum bonding; optimum heat dissipation; optimum materials homogeneity; test location; test time; thermal conductivity; thermal conductivity homogeneity; thermal conductivity topography; thermal design; thermal management materials; Bonding; Boron; Conducting materials; Design engineering; Heat engines; Surfaces; Testing; Thermal conductivity; Thermal engineering; Thermal management;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-5264-5
DOI :
10.1109/STHERM.1999.762436