Title :
Performance comparison of BGA and flex-CSP using parametric FEA models
Author :
Lall, Balwant S Bill
Author_Institution :
Crown Int. Inc., Elkhart, IN, USA
Abstract :
A comparative investigation of the BGA and flex-CSP designs for packaging of high-performance semiconductors is presented. Parametric finite-element models of the packages are used to study sensitivity, thermal performance, mechanical stresses and reliability on package construction, and correlations for critical spreading resistances are presented. Both the standard and enhanced BGA designs along with thermal and reliability effects of thermal balls are studied. The flex-CSP provides comparable thermal performance to the standard BGA due to a much smaller heat-injection area into the motherboard.
Keywords :
ball grid arrays; chip scale packaging; finite element analysis; integrated circuit modelling; integrated circuit reliability; internal stresses; thermal analysis; thermal management (packaging); thermal stresses; BGA; BGA design; critical spreading resistances; enhanced BGA design; flex-CSP; flex-CSP design; high-performance semiconductor packaging; mechanical stresses; motherboard; package construction; package heat-injection area; packaging; parametric FEA models; parametric finite-element models; reliability; reliability effects; sensitivity; standard BGA design; thermal balls; thermal effects; thermal performance; Assembly; Chip scale packaging; Copper; Electronics packaging; Field emitter arrays; Flexible electronics; Lead; Semiconductor device packaging; Wafer scale integration; Wire;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-5264-5
DOI :
10.1109/STHERM.1999.762437
