Performance comparison of BGA and flex-CSP using parametric FEA models

Author

Lall, Balwant S Bill

Author_Institution

Crown Int. Inc., Elkhart, IN, USA

fYear

1999

fDate

9-11 March 1999

Firstpage

119

Lastpage

124

Abstract

A comparative investigation of the BGA and flex-CSP designs for packaging of high-performance semiconductors is presented. Parametric finite-element models of the packages are used to study sensitivity, thermal performance, mechanical stresses and reliability on package construction, and correlations for critical spreading resistances are presented. Both the standard and enhanced BGA designs along with thermal and reliability effects of thermal balls are studied. The flex-CSP provides comparable thermal performance to the standard BGA due to a much smaller heat-injection area into the motherboard.

Keywords

ball grid arrays; chip scale packaging; finite element analysis; integrated circuit modelling; integrated circuit reliability; internal stresses; thermal analysis; thermal management (packaging); thermal stresses; BGA; BGA design; critical spreading resistances; enhanced BGA design; flex-CSP; flex-CSP design; high-performance semiconductor packaging; mechanical stresses; motherboard; package construction; package heat-injection area; packaging; parametric FEA models; parametric finite-element models; reliability; reliability effects; sensitivity; standard BGA design; thermal balls; thermal effects; thermal performance; Assembly; Chip scale packaging; Copper; Electronics packaging; Field emitter arrays; Flexible electronics; Lead; Semiconductor device packaging; Wafer scale integration; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE

Conference_Location

San Diego, CA, USA

ISSN

1065-2221

Print_ISBN

0-7803-5264-5

Type

conf

DOI

10.1109/STHERM.1999.762437

Filename

762437