DocumentCode :
2774493
Title :
Lead On Chip TSOP Assembly Process For Fast Sram With Peripherally Located Bond Pads
Author :
Hagen, Debbie ; McDermott, Joan ; Bigler, Jerry ; Cavasin, Daniel ; Primeaux, Francis ; Tran, Ziep ; Afshar, David
Author_Institution :
Motorola
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
39
Lastpage :
47
Keywords :
Assembly; Atherosclerosis; Bonding; Integrated circuit packaging; Lab-on-a-chip; Microassembly; Plastic packaging; Random access memory; Semiconductor device packaging; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639859
Filename :
639859
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2774493
