DocumentCode :
2774540
Title :
Junction-to-top and junction-to-board thermal resistance measurement for 119 BGA packages
Author :
Chung, Taegyeong ; Kim, Minha ; Baek, Joonghyun ; Oh, Seyong
Author_Institution :
Samsung Electron. Co., Asan-city, South Korea
fYear :
1999
fDate :
9-11 March 1999
Firstpage :
142
Lastpage :
150
Abstract :
Junction-to-top (/spl theta//sub jt/) and junction-to-board (/spl theta//sub jb/) thermal resistance of a 119 BGA package for 4 Mbit SP SRAM have been investigated using the cold plate-Teflon block method and was compared with the junction-to-case thermal resistance (/spl theta//sub jc/) measurement method. Both thermal dice and real dice were prepared to measure the 119 BGA package thermal resistance. The junction-to-case and junction-to-top thermal resistance for a real die are about 3.5/spl deg/C/W and 3.8/spl deg/C/W respectively, whereas with a thermal die, the junction-to-case and junction-to-top thermal resistance are 4.0/spl deg/C/W and 4.8/spl deg/C/W respectively. For both thermal and real die, the junction-to-case thermal resistance is less than the junction-to-top thermal resistance. This is attributed to the different thermal boundary conditions applied to the 119 BGA package for each test method. In the meantime, thermal resistances of packages with thermal dice were approximately 14.3/spl sim/26.3% higher than those of package with real dice, the reason for which is being investigated.
Keywords :
SRAM chips; ball grid arrays; integrated circuit measurement; integrated circuit packaging; thermal management (packaging); thermal resistance measurement; BGA package thermal resistance; BGA packages; SP SRAM; cold plate-Teflon block method; junction-to-board thermal resistance; junction-to-case thermal resistance; junction-to-case thermal resistance measurement method; junction-to-top thermal resistance; test method; thermal boundary conditions; thermal dice; thermal resistance; Electrical resistance measurement; Electronic packaging thermal management; Lead; Random access memory; Semiconductor device measurement; Temperature measurement; Temperature sensors; Testing; Thermal conductivity; Thermal resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
ISSN :
1065-2221
Print_ISBN :
0-7803-5264-5
Type :
conf
DOI :
10.1109/STHERM.1999.762441
Filename :
762441
Link To Document :
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