Title :
Substrate coupling: modeling, simulation and design perspectives
Author :
Gharpurey, Ranjit ; Charbon, Edoardo
Author_Institution :
Michigan Univ., Ann Arbor, MI, USA
Abstract :
The finite impedance of silicon substrates has several consequences for the design and performance of ICs. In this paper, we discuss the state of the art in the areas of modeling and simulation of these effects. An overview of various modeling techniques is presented, with emphasis on integral-equation based boundary-element techniques. Numerical stability issues related to these techniques are discussed from a physical viewpoint. The impact on circuit design is considered by the means of specific examples.
Keywords :
boundary integral equations; boundary-elements methods; circuit simulation; coupled circuits; integrated circuit design; integrated circuit modelling; integrated circuit noise; Si; digital noise; integral-equation based boundary-element techniques; numerical stability; power supply noise; silicon substrate finite impedance; substrate coupling; substrate-coupled noise; CMOS technology; Computational modeling; Design optimization; Impact ionization; Iterative algorithms; Iterative methods; Silicon; Space technology; USA Councils; Voltage;
Conference_Titel :
Quality Electronic Design, 2004. Proceedings. 5th International Symposium on
Print_ISBN :
0-7695-2093-6
DOI :
10.1109/ISQED.2004.1283687
