DocumentCode :
2774559
Title :
A review of IBM sponsored research and development projects for computer cooling
Author :
Chu, R.C.
Author_Institution :
Int. Bus. Machines, Poughkeepsie, NY, USA
fYear :
1999
fDate :
9-11 March 1999
Firstpage :
151
Lastpage :
165
Abstract :
This paper provides a review of twenty-five years of IBM sponsored research at universities intended to advance basic heat transfer technology for application in cooling computers. The research discussed covers a broad range of heat transfer topics, including natural convection and forced convection air cooling. Liquid forced convection, pool boiling, falling films, flow boiling, and liquid jet impingement. Examples of actual IBM cooling applications related to some of the research are given. In addition, some of the development activities conducted within IBM to advance computer cooling technology are highlighted. Specific topics covered are direct liquid cooling, thermal conduction module (TCM) cooling, low temperature cooling, and special cooling technology.
Keywords :
IBM computers; boiling; cooling; forced convection; jets; mainframes; microcomputers; natural convection; research and development management; reviews; thermal management (packaging); IBM cooling applications; IBM sponsored research and development projects; TCM cooling; computer cooling; computer cooling technology; cooling; cooling technology; direct liquid cooling; falling films; flow boiling; forced convection air cooling; heat transfer; heat transfer technology; liquid forced convection; liquid jet impingement; low temperature cooling; natural convection air cooling; pool boiling; thermal conduction module cooling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
ISSN :
1065-2221
Print_ISBN :
0-7803-5264-5
Type :
conf
DOI :
10.1109/STHERM.1999.762443
Filename :
762443
Link To Document :
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