Title :
FMI applied to the study of the temperature distribution in flip chips
Author :
Boyer, N. ; Masson, D.P. ; Meunier, M. ; Simard-Normandin, M.
Author_Institution :
Centre for Microanalysis, Nortel Networks, Nepean, Ont., Canada
Abstract :
The use of fluorescent microthermal imaging (FMI) as a tool to study the temperature distribution in flip chip packages was investigated. Backgrinding of the die was required to minimize heat diffusion and maximize the spatial resolution. A test structure was created in order to evaluate FMI spatial resolution from the backside of flip chips as a function of the die thickness and of the power dissipation. A lateral resolution of 50 /spl mu/m is obtained after polishing the die to a thickness of 5 /spl mu/m. At this thickness, the centre of a hot spot can be located with a precision of /spl plusmn/5 /spl mu/m. For a 5 /spl mu/m thick die, the FMI temperature map revealed the heat-sinking effect of the flip chip´s solder bumps.
Keywords :
failure analysis; flip-chip devices; fluorescence; image resolution; infrared imaging; integrated circuit interconnections; integrated circuit packaging; polishing; soldering; temperature distribution; thermal analysis; thermal management (packaging); 5 micron; FMI; FMI spatial resolution; backgrinding; die thickness; flip chip backside; flip chip packages; flip chip solder bumps; flip chips; fluorescent microthermal imaging; heat diffusion; heat-sinking effect; hot spot location; lateral resolution; polishing; power dissipation; spatial resolution; temperature distribution; test structure; Copper; Failure analysis; Flip chip; Fluorescence; Heat sinks; Integrated circuit packaging; Integrated circuit technology; Packaging machines; Spatial resolution; Temperature distribution;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-5264-5
DOI :
10.1109/STHERM.1999.762444
