FMI applied to the study of the temperature distribution in flip chips

Author

Boyer, N. ; Masson, D.P. ; Meunier, M. ; Simard-Normandin, M.

Author_Institution

Centre for Microanalysis, Nortel Networks, Nepean, Ont., Canada

fYear

1999

fDate

9-11 March 1999

Firstpage

166

Lastpage

172

Abstract

The use of fluorescent microthermal imaging (FMI) as a tool to study the temperature distribution in flip chip packages was investigated. Backgrinding of the die was required to minimize heat diffusion and maximize the spatial resolution. A test structure was created in order to evaluate FMI spatial resolution from the backside of flip chips as a function of the die thickness and of the power dissipation. A lateral resolution of 50 /spl mu/m is obtained after polishing the die to a thickness of 5 /spl mu/m. At this thickness, the centre of a hot spot can be located with a precision of /spl plusmn/5 /spl mu/m. For a 5 /spl mu/m thick die, the FMI temperature map revealed the heat-sinking effect of the flip chip´s solder bumps.

Keywords

failure analysis; flip-chip devices; fluorescence; image resolution; infrared imaging; integrated circuit interconnections; integrated circuit packaging; polishing; soldering; temperature distribution; thermal analysis; thermal management (packaging); 5 micron; FMI; FMI spatial resolution; backgrinding; die thickness; flip chip backside; flip chip packages; flip chip solder bumps; flip chips; fluorescent microthermal imaging; heat diffusion; heat-sinking effect; hot spot location; lateral resolution; polishing; power dissipation; spatial resolution; temperature distribution; test structure; Copper; Failure analysis; Flip chip; Fluorescence; Heat sinks; Integrated circuit packaging; Integrated circuit technology; Packaging machines; Spatial resolution; Temperature distribution;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE

Conference_Location

San Diego, CA, USA

ISSN

1065-2221

Print_ISBN

0-7803-5264-5

Type

conf

DOI

10.1109/STHERM.1999.762444

Filename

762444