DocumentCode :
2774667
Title :
Modeling the skin effect in the time domain for the simulation of circuit interconnects
Author :
Magdowski, Mathias ; Kochetov, Sergey ; Leone, Marco
Author_Institution :
Inst. for Fundamental Electr. Eng. & Electromagn. Compatibility, Otto-von-Guericke Univ. Magdeburg, Magdeburg
fYear :
2008
fDate :
8-12 Sept. 2008
Firstpage :
1
Lastpage :
6
Abstract :
The skin effect is characterized by a reduction of a conductor´s effective cross-sectional area and is of great importance for the losses in electrical interconnection systems. Many well-known solutions exist for its modeling in the frequency domain. Based on the method of full spectrum convolution macromodeling a new skin-effect model is developed for an efficient numerical time-domain analysis. The integration of this model into the transmission line model and into the PEEC model is studied in two examples. Thereby the influence of skin effect on the simulation of interconnection systems with transient current and voltage responses is investigated.
Keywords :
integrated circuit interconnections; integrated circuit modelling; numerical analysis; skin effect; time-domain analysis; PEEC model; circuit interconnects; electrical interconnection systems; full spectrum convolution macromodeling; numerical time-domain analysis; skin effect; time domain; Circuit simulation; Conductors; Convolution; Frequency; Impedance; Inductance; Integrated circuit interconnections; Power transmission lines; Skin effect; Wire; skin effect modeling time domain full spectrum convolution macromodeling PEEC;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
Conference_Location :
Hamburg
Print_ISBN :
978-1-4244-2737-6
Electronic_ISBN :
978-1-4244-2737-6
Type :
conf
DOI :
10.1109/EMCEUROPE.2008.4786892
Filename :
4786892
Link To Document :
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