Title :
bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages
Author :
Shaukatullah, H.
Author_Institution :
Div. of Storage Syst., IBM Corp., Tucson, AZ, USA
Abstract :
A bibliography of 225 publications dealing with liquid cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks and extended surfaces cooled with liquids. The papers are arranged in several categories.
Keywords :
bibliographies; cooling; design engineering; heat sinks; thermal management (packaging); bibliography; electronic package thermal enhancement; electronic packages; heat sink design; heat sink performance analysis; liquid cooled extended surfaces; liquid cooled heat sinks; Bibliographies; Books; Circuits; Cold plates; Electronic components; Electronic packaging thermal management; Electronics cooling; Heat sinks; Thermal management; Thermal management of electronics;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1999. Fifteenth Annual IEEE
Conference_Location :
San Diego, CA, USA
Print_ISBN :
0-7803-5264-5
DOI :
10.1109/STHERM.1999.762454
