DocumentCode
2774696
Title
Application Of Tab In High Performance Single Chip Package
Author
Stricot, Y.
Author_Institution
BULL S.A.
fYear
1992
fDate
28-30 Sep 1992
Firstpage
48
Lastpage
52
Keywords
Assembly; Bonding; Capacitors; Ceramics; Electronic packaging thermal management; Electronics packaging; Integrated circuit packaging; Lead; Thermal resistance; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN
0-7803-0755-0
Type
conf
DOI
10.1109/IEMT.1992.639860
Filename
639860
Link To Document