Title :
Predicting interconnect uncertainty with a new robust model order reduction method
Author :
Wang, Janet ; Hafiz, Omar
Author_Institution :
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
Abstract :
As we scale toward nanometer technologies, the increase in interconnect parameter variations will bring significant performance variability. New design methodologies will emerge to facilitate construction of reliable systems from unreliable nanometer scale components. Such methodologies require new performance models which accurately capture the manufacturing realities. In this paper, we present a Linear Fractional Transform (LFT) based model for interconnect Parametric Uncertainty. This new model formulates the interconnect parameter uncertainty as a repeated scalar uncertainty structure. With the help of generalized Balanced Truncation Realization (BTR) based on Linear Matrix Inequalities (LMIs), the new model reduces the order of the original interconnect network while preserves the stability. This paper also shows that the LFT based model even guarantees passivity if the BTR reduction is based on solutions to a pair of Linear Matrix Inequalities (LMIs) which generalizes Lur´e equations.
Keywords :
VLSI; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; linear matrix inequalities; reduced order systems; state-space methods; transfer function matrices; deep-submicron VLSI; generalized balanced truncation realization; interconnect parameter variations; interconnect uncertainty; linear fractional transform based model; linear matrix inequalities; performance variability; repeated scalar uncertainty structure; robust model order reduction method; state-space model; transfer functions; Design methodology; Integrated circuit interconnections; Linear matrix inequalities; Predictive models; Reliability engineering; Robustness; Stability; Uncertain systems; Uncertainty; Virtual manufacturing;
Conference_Titel :
Quality Electronic Design, 2004. Proceedings. 5th International Symposium on
Print_ISBN :
0-7695-2093-6
DOI :
10.1109/ISQED.2004.1283701