Title :
A microstrip antenna with flip-chip interconnect for millimetre wave transceiver on CMOS
Author :
Felic, G. ; Skafidas, E.
Author_Institution :
NICTA Victoria Res. Lab., Univ. of Melbourne, Melbourne, VIC
Abstract :
In this work, a new CPW-fed microstrip (patch) antenna concept for integration with mm-wave transceiver circuits is presented. The antenna is designed and fabricated using standard printed circuit board technology. The attachment to the CMOS die is achieved through flip-chip bonding. The performance of the design and quality of flip-bonding process are verified by measurements through a -10 dB return loss bandwidth of 8 GHz. The measured and simulated results encourage us to go step further and integrate proposed antenna into the 60 GHz transceiver package.
Keywords :
CMOS integrated circuits; antenna feeds; coplanar waveguides; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; microstrip antennas; microwave antennas; millimetre wave devices; transceivers; CMOS; CPW-fed microstrip antenna; flip-bonding process; flip-chip interconnects; frequency 7 GHz; microstrip antenna; millimetre wave transceiver; mm-wave transceiver circuits; printed circuit board technology; return loss bandwidth; transceiver package; Antenna measurements; Bonding; CMOS technology; Integrated circuit interconnections; Integrated circuit measurements; Microstrip antennas; Millimeter wave technology; Performance loss; Printed circuits; Transceivers;
Conference_Titel :
Antennas and Propagation Society International Symposium, 2008. AP-S 2008. IEEE
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-2041-4
Electronic_ISBN :
978-1-4244-2042-1
DOI :
10.1109/APS.2008.4619751
