A microstrip antenna with flip-chip interconnect for millimetre wave transceiver on CMOS

Author

Felic, G. ; Skafidas, E.

Author_Institution

NICTA Victoria Res. Lab., Univ. of Melbourne, Melbourne, VIC

fYear

2008

fDate

5-11 July 2008

Firstpage

1

Lastpage

4

Abstract

In this work, a new CPW-fed microstrip (patch) antenna concept for integration with mm-wave transceiver circuits is presented. The antenna is designed and fabricated using standard printed circuit board technology. The attachment to the CMOS die is achieved through flip-chip bonding. The performance of the design and quality of flip-bonding process are verified by measurements through a -10 dB return loss bandwidth of 8 GHz. The measured and simulated results encourage us to go step further and integrate proposed antenna into the 60 GHz transceiver package.

Keywords

CMOS integrated circuits; antenna feeds; coplanar waveguides; flip-chip devices; integrated circuit bonding; integrated circuit interconnections; microstrip antennas; microwave antennas; millimetre wave devices; transceivers; CMOS; CPW-fed microstrip antenna; flip-bonding process; flip-chip interconnects; frequency 7 GHz; microstrip antenna; millimetre wave transceiver; mm-wave transceiver circuits; printed circuit board technology; return loss bandwidth; transceiver package; Antenna measurements; Bonding; CMOS technology; Integrated circuit interconnections; Integrated circuit measurements; Microstrip antennas; Millimeter wave technology; Performance loss; Printed circuits; Transceivers;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation Society International Symposium, 2008. AP-S 2008. IEEE

Conference_Location

San Diego, CA

Print_ISBN

978-1-4244-2041-4

Electronic_ISBN

978-1-4244-2042-1

Type

conf

DOI

10.1109/APS.2008.4619751

Filename

4619751