• DocumentCode
    2774893
  • Title

    Encapsulation Of Flip Chip Structures

  • Author

    Machuga, Steven C. ; Lindsey, Scott E. ; Moore, Kevin D. ; Skipor, Andrew F.

  • Author_Institution
    Motorola Inc.
  • fYear
    1992
  • fDate
    28-30 Sep 1992
  • Firstpage
    53
  • Lastpage
    58
  • Keywords
    Assembly; Encapsulation; Fatigue; Flip chip; Integrated circuit interconnections; Packaging; Silicon devices; Substrates; Thermal expansion; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
  • Print_ISBN
    0-7803-0755-0
  • Type

    conf

  • DOI
    10.1109/IEMT.1992.639861
  • Filename
    639861
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2774893