Title :
Wirability of logic circuit packages in LSI and VLSI
Author :
Heller, William R.
Author_Institution :
California institute of Technology
Keywords :
Computer aided manufacturing; Costs; Integrated circuit packaging; Large scale integration; Logic circuits; Logic design; Logic devices; Semiconductor device packaging; Very large scale integration; Wiring;
Conference_Titel :
Computer Software and Applications Conference, 1979. Proceedings. COMPSAC 79. The IEEE Computer Society's Third International
DOI :
10.1109/CMPSAC.1979.762473
