Title :
Role And Measurement Of Trimming Shock On Component Lead
Author :
Wolfovitz, David ; Barker, Donald ; Pecht, Michael
Author_Institution :
University of Maryland
Keywords :
Assembly; Electric shock; Electronics packaging; Failure analysis; Geometry; Lead; Production; Soldering; Surface resistance; Tensile stress;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
DOI :
10.1109/IEMT.1992.639863
