DocumentCode :
2775515
Title :
High frequency and transient coupling to pasive conductors near grounding systems in layered soil
Author :
Arnautovski-Toseva, Vesna ; Grcev, Leonid ; Petkoski, Spase ; El Khamlichi Drissi, Khalil
Author_Institution :
Fac. of Electr. Eng. & Inf. Technol., Ss Cyril & Methodius Univ., Skopje
fYear :
2008
fDate :
8-12 Sept. 2008
Firstpage :
1
Lastpage :
5
Abstract :
This paper presents the ongoing research results of the high frequency and transient grounding system analysis in two-layer soil structure. On the basis of rigorous electromagnetic field theory, which involves Sommerfeld´s integrals, the mathematical model is formulated by the mixed potential integral equation (MPIE). Detailed analysis of a high frequency performance of a typical horizontal grounding conductor placed in the upper or in the bottom layer is given. It is shown that because of the presence of two distinct layers the current distribution and the impedance to ground are highly affected by the parameters of both soil layers. Also, the current distribution in near-by passive horizontal conductor is analyzed. At the end of the paper some observations about the effects of two-layer soil structure at high frequencies are given.
Keywords :
conductors (electric); current distribution; earthing; electromagnetic coupling; electromagnetic field theory; integral equations; soil; transient analysis; Sommerfeld integrals; current distribution; mathematical model; mixed potential integral equation; near-by passive horizontal conductor; passive conductors; rigorous electromagnetic field theory; transient grounding system analysis; two-layer soil structure; typical horizontal grounding conductor; Conductors; Current distribution; Electromagnetic field theory; Electromagnetic transients; Frequency; Grounding; Integral equations; Mathematical model; Soil; Transient analysis; electromagnetic model; grounding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility - EMC Europe, 2008 International Symposium on
Conference_Location :
Hamburg
Print_ISBN :
978-1-4244-2737-6
Electronic_ISBN :
978-1-4244-2737-6
Type :
conf
DOI :
10.1109/EMCEUROPE.2008.4786932
Filename :
4786932
Link To Document :
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