Title :
Conductive Filament Formation In Printed Wiring Boards
Author :
Wul, Bi-Chu ; Pecht, Michael ; Jennings, David
Author_Institution :
University of Maryland, College Park, Maryland 20742 2Collins Divisions, Rockwell International
Keywords :
Coatings; Conducting materials; Copper; Electrodes; Electronic equipment testing; Glass; Materials testing; Resins; Samarium; Wiring;
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
DOI :
10.1109/IEMT.1992.639865
