• DocumentCode
    2776167
  • Title

    Nano-structured Interconnects for System Integration

  • Author

    Aschenbrenner, R. ; Fiedler, S. ; Löher, T. ; Pahl, B. ; Becker, K.-F. ; Reichl, H.

  • Author_Institution
    Fraunhofer Inst. for Reliability & Microintegration, Berlin
  • fYear
    2006
  • fDate
    11-14 Dec. 2006
  • Firstpage
    1
  • Lastpage
    26
  • Abstract
    A collection of slides from author´s conference presentation is given.
  • Keywords
    integrated circuit interconnections; nanoelectronics; nanoelectronics; nanolawn; nanostructured interconnects; reactive interconnect; system integration; Bonding; CMOS technology; Copper; Nanoscale devices; Nanostructured materials; Nanostructures; Packaging; Polymers; Temperature sensors; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
  • Conference_Location
    Kowloon
  • Print_ISBN
    978-1-4244-0834-4
  • Electronic_ISBN
    978-1-4244-0834-4
  • Type

    conf

  • DOI
    10.1109/EMAP.2006.4430562
  • Filename
    4430562
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2776167