Title :
System-In-Package Approach for Ultra-High-Power Semiconductor Devices
Author_Institution :
President, NeoPac Lighting
Keywords :
Costs; Discrete wavelet transforms; Engines; Intersymbol interference; LED lamps; Light emitting diodes; Semiconductor device packaging; Semiconductor devices; Tellurium; Thermal management;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon, China
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430564
