Title :
Wirebond Bond Process Control and Monitoring System
Abstract :
An in-line system is designed and developed that can capture the bond traces of Orthodyne M360 machine and use them as an added in line-control to wirebonding process. It will strengthen the Wirebonding Process control by making it a closed loop system and not human dependent. It will reduce manual product handling & checking of Operators and Line Inspectors. The trace or signal of a known good bond can be used as a standard reference, and all traces outside this standard can be considered as rejects. Based from the results of study and evaluation, the project is feasible and it can be integrated to the existing wirebond machine.
Keywords :
closed loop systems; electronics industry; lead bonding; process control; process monitoring; Orthodyne M360 machine model; bond quality determination; bond traces; closed loop system; in-line control system; line inspectors checking; manual product handling reduction; operators checking; process monitoring system; wirebond machine; wirebonding process control; Bonding forces; Feedback loop; Force control; Force feedback; Geometry; Integrated circuit testing; Monitoring; Process control; Size control; Wire;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430575
