DocumentCode :
2776541
Title :
New Requirements And Solutions For Product Data Processing Of Three-dimensional Molded Interconnection Devices
Author :
Feldmann, K. ; Franke, J.
fYear :
1992
fDate :
28-30 Sep 1992
Firstpage :
94
Lastpage :
99
Keywords :
Assembly; Bonding; Computer aided manufacturing; Consumer electronics; Data processing; Electronic equipment manufacture; Integrated circuit interconnections; Printed circuits; Production; Technological innovation;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronics Manufacturing Technology Symposium, 1992., Thirteenth IEEE/CHMT International
Print_ISBN :
0-7803-0755-0
Type :
conf
DOI :
10.1109/IEMT.1992.639869
Filename :
639869
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2776541
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