Title :
Development of High Adhesion Nano-Thermal Interface Materials for Electronics Packaging Applications
Author :
Aronsson, Tomas ; Wang, Wen Xuan ; Olorunyomi, M.O. ; Lu, Xiuzhen ; Shangguan, Dongkai ; Liu, Johan
Author_Institution :
Chalmers Univ. of Technol., Goteborg
Abstract :
This paper reports the results of an investigation to create a thermal interface material (TIM) with adhesive functions. Previous tests with electro-spun nano fibrous polymer materials indicate high thermal conductivity of the films, and even higher thermal conductivity and lower resistivity had subsequently been obtained by adding thermally conductive nano particles. The thickness of the TIMs produced are around 0.1 mm which is ideal for a TIM due to its low thermal resistance. In this investigation, adhesives were added to create a nano-fibrous film with high adhesion. Shear tests were conducted to measure the strength of the adhesive film after curing and the results are presented. The nano-TIM film also exhibited very good elastic properties and had a shelf life of up to 24 hours.
Keywords :
adhesives; integrated circuit packaging; nanoparticles; polymer fibres; thermal conductivity; thermal management (packaging); thermal resistance; adhesive film; elastic properties; electro-spun nano fibrous polymer materials; electronics packaging applications; high adhesion nanothermal interface materials; nanofibrous film; shear tests; thermal resistance; thermally conductive nano particles; Adhesives; Conducting materials; Conductive films; Electronic packaging thermal management; Electronics packaging; Materials testing; Nanostructured materials; Polymer films; Thermal conductivity; Thermal resistance;
Conference_Titel :
Electronic Materials and Packaging, 2006. EMAP 2006. International Conference on
Conference_Location :
Kowloon
Print_ISBN :
978-1-4244-0834-4
Electronic_ISBN :
978-1-4244-0834-4
DOI :
10.1109/EMAP.2006.4430601
