Title : 
InP and silica photonic integrated circuits for high spectral efficiency fiber-optic communications
         
        
        
            Author_Institution : 
Bell Labs., Alcatel-Lucent, Holmdel, NJ, USA
         
        
        
        
        
        
            Abstract : 
This talk will focus on silica PICs and InP PICs. Silica PICs are well suited for in-line components, which must be low loss and can have slow dynamics. InP PICs are well suited for transmitters and receivers, which must provide light generation/amplification, high-speed modulation, and high-speed reception. For silica PICs we will discuss optical equalizers, which can correct for the intersymbol interference commonly encountered in high spectral efficiency systems; interleavers for ultra-narrow channel spacings; demodulators for differential quadrature phase-shift keying (DQPSK); and modulators built using a combination of silica and LiNbO3.
         
        
            Keywords : 
III-V semiconductors; channel spacing; differential phase shift keying; equalisers; high-speed optical techniques; indium compounds; integrated optoelectronics; intersymbol interference; lithium compounds; optical communication equipment; optical fibre communication; optical modulation; silicon compounds; InP; LiNbO3; SiO2; differential quadrature phase-shift keying; fiber-optic communication; high-spectral efficiency; high-speed modulation; high-speed reception; intersymbol interference; light generation; optical demodulator; optical equalizer; optical receiver; optical transmitter; silica photonic integrated circuit; ultra-narrow channel spacing; High speed optical techniques; Indium phosphide; Optical fiber communication; Optical losses; Optical modulation; Optical receivers; Optical transmitters; Photonic integrated circuits; Silicon compounds; Stimulated emission;
         
        
        
        
            Conference_Titel : 
Lasers and Electro-Optics 2009 and the European Quantum Electronics Conference. CLEO Europe - EQEC 2009. European Conference on
         
        
            Conference_Location : 
Munich
         
        
            Print_ISBN : 
978-1-4244-4079-5
         
        
            Electronic_ISBN : 
978-1-4244-4080-1
         
        
        
            DOI : 
10.1109/CLEOE-EQEC.2009.5191634